Operational Excellence
State-of-the-art equipment and processes delivering precision, quality, and reliability across every manufacturing stage.
SMT Assembly
Pick-and-Place
MYDATA / Mycronic MY100SX (SMT1)
- •Throughput: 21,500 CPH rated, ~17,800 CPH IPC-9850
- •Component range: 01005–QFP/flip-chip
- •Typical max part: ~18.6×18.6×5.6 mm
Use Case: Dual Vision, high-precision head, on-the-fly electrical verification
JUKI KE-3020 class (SMT2)
- •Placement accuracy: ±0.05 mm (laser); ±0.03–0.04 mm (vision/MNVC)
- •Component sizes: 01005 to ~33.5 mm
- •Tall parts up to 25 mm (XL)
Use Case: Dual-lane configuration available for higher UPH
MYDATA MY12E (SMT3)
- •Dual-mode: 21,000 CPH (HYDRA) for chips
- •~6,100 CPH for fine-pitch
- •Handles QFP, CSP, BGA
Use Case: Ideal for flexible short-run/high-mix work
Printing & SPI
Solder Paste Application
DEK Horizon 03iX / ASM-DEK (SMT1 & SMT3)
- •Board size: 40×50 mm up to 508×508 mm
- •Thickness: 0.2–6 mm
- •Alignment capability: ≈±25 µm @ 2.0 Cmk
Use Case: 2D paste inspection available
JUKI PMAXII (Large-format printer – SMT2)
- •Stencil range up to 1500×1250 mm
- •Dual independent heads
- •Programmable squeegee: 0–30 kg, 5–150 mm/s
Use Case: Closed-loop with SPI
AMS / VI Technology 3D SPI
- •Modern 3D SPI detects height/volume/area/alignment
- •Prevents >70% of print-related defects
- •Supports 0201 (metric) pads
Use Case: Real-time analytics, line-integrated
Reflow
Solder Reflow Systems
ERSA HOTFLOW 3/20 (SMT1)
- •10 heating zones (7 preheat + 3 peak)
- •Multi-level cooling, dual-track options
- •Conveyor speed 20–200 cm/min
Use Case: Process length >5 m; robust nitrogen & energy management
HELLER 1809 (MK series) (SMT3)
- •9 heated zones with low ΔT
- •Energy management
- •Medium/high-volume capable
Use Case: Proven reliability for consistent thermal profiles
JUKI RS-800II (SMT2)
- •8 heat / 2 cool zones
- •3.12 m heated length, 300 °C zone capability
- •<±2 °C ΔT; nitrogen-ready
Use Case: Precise temperature control for sensitive components
Selective/Wave
Through-Hole Soldering
ACE KISS-103 Selective Solder
- •Traveling mini-wave system for tight-clearance THT
- •Board size up to 18″×24″
- •~30 lb pot; automated fluxing
Use Case: Precise molten delivery on dense SMT boards
ERSA / JUKI CUBE.460 Selective Solder
- •PCB size up to 460×460 mm
- •0°/7° tilt, program-controlled solder temp/height
- •Multiple mini-wave nozzles (Ø4–20 mm)
Use Case: Nitrogen capable; ideal for complex assemblies
DDM Novastar Wave Solder
- •Lead/lead-free, single or dual wave
- •Wave widths 14–24″ with quick-change pots
- •Conveyor 0.5–2.5 m/min
Use Case: Model-dependent configuration for various throughput needs
Inspection & Test
Quality Verification
Parmi Xceed New Generation 3D AOI
- •4 Mega Pixel Telecentric Lens Fast Speed CMOS camera
- •Fastest Inspection Speed: 65cm² @ 14×14µm resolution
- •Guarantee accuracy up to 10mm (±5mm) warpage
Use Case: Ultra-fast 3D inspection with high warpage tolerance
Glenbrook JewelBox
- •80 kV / 100 µA source
- •Variable 7×–2000× magnification
- •~10 µm focal spot
Use Case: Ideal for BGA/QFN voiding & barrel-fill analysis
SPEA Flying-Probe Test
- •Ultra-high-speed 4-probe platform
- •Linear encoders down to 12 nm resolution
- •Supports opens/shorts, analog, boundary-scan
Use Case: Comprehensive electrical testing without custom fixtures
Cleaning & Coating
Protection Systems
Aqueous Technologies TRIDENT DUO Batch Cleaner
- •Closed-loop / low-discharge aqueous deflux
- •SPC tracking with dual-chamber configurations
- •Recipe control and barcode logging
Use Case: Thorough cleaning with environmental efficiency
SCS PrecisionCoat V Conformal Coating
- •Automated selective coating/dispense platform
- •Supports solvent, water-based, and 100% solids materials
- •Multi-head, high-accuracy motion control
Use Case: Precision coating for environmental protection
Rework
BGA/QFN/CSP/PoP
Air-Vac Engineering DRS-25 / DRS-27
- •Semi-auto & high-mass rework systems
- •Closed-loop mass-flow heat control, 8 thermocouples
- •Large board support up to ~32″×24″ (DRS-27)
Use Case: Proven capability down to 01005, precise vision alignment, programmable board cooling
Inline PCB Cleaner & Nitrogen Generation
- •Inline high-pressure PCB cleaning
- •On-site nitrogen supply
- •Low residual O₂ support
Use Case: Stable reflow/selective soldering with improved wetting and reduced defects
